This paper presents the use of Finite Element Analysis (FEA) to model a new packaging technique capable of minimizing the impact of bending or shear stresses on components integrated within the yarn of an electronic textile. FEA has been used to model four conditions: shear load, tensile load, three point bending load and a change in temperature. Three types of adhesive (Dymax 3031, Delomonopox Mk055 and Delomonopox NU355) combined with three substrate materials, PEEK, Kapton and Mylar have been analyzed. The Kapton substrate with the Dymax 3031 adhesive are identified as the preferred material combination for the packaging assembly. The simulation results indicate that the lower Young's modulus of the adhesive and substrate materials produces smaller stresses in the shear, tensile and bending models. The lower coefficient of thermal expansion (CTE) of these materials also produces lower stresses when thermally cycled.
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